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| Application Number | 2174859 |
| Trademark Status | Registered |
| Trademark Class | 7 |
| Trademark Description | DIE BONDERS FOR USE IN SEMICONDUCTOR MANUFACTURING; WIRE BONDERS FOR USE IN SEMICONDUCTOR MANUFACTURING; CHIP ON FILM BONDERS FOR USE IN SEMICONDUCTOR MANUFACTURING; FLIP CHIP BONDERS FOR USE IN SEMICONDUCTOR MANUFACTURING; BUMP BONDERS FOR USE IN SEMICONDUCTOR MANUFACTURING; SEMICONDUCTOR MANUFACTURING MACHINES AND SYSTEMS; ULTRASONIC CLEANING MACHINES FOR USE IN SEMICONDUCTOR MANUFACTURING AND THEIR PARTS; ULTRASONIC CLEANING MACHINES FOR ELECTRONIC COMPONENTS, CERAMICS, GLASS COMPONENTS, PLASTIC MOLDINGS AND METAL WORKED COMPONENTS AND THEIR PARTS; ULTRASONIC CLEANING MACHINES FOR INDUSTRIAL PURPOSES AND THEIR PARTS; ULTRASONIC CLEANING MACHINES FOR HOUSEHOLD PURPOSES AND THEIR PARTS; ULTRASONIC BATHS; ULTRASONIC CLEANING APPARATUS; ULTRASONIC DE-GREASING MACHINES; ULTRASONIC WASHING MACHINES; ULTRASONIC WELDING HEADS; ULTRASONIC WELDING MACHINES; CHEMICAL PROCESSING MACHINES AND APPARATUS; METALWORKING MACHINES AND TOOLS. |
| Application Date | 2011-07-14 |
| Journal No. | 1767-0 |
| Journal Date | 2016-10-17 |
| Proprietor Name | KAIJO CORPORATION |
| User Details | 2021-07-14 |
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